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F21P - Intel Core i7 2nd gen CPU Board

3U CompactPCI PlusIO The F21P 4HP/3U CPU board is compatible to the CompactPCI Plus IO standard and equipped with the 2nd generation Intel Core i7-2715QE processor and the QM67 platform controller hub.

Petr Chalupa

Petr Chalupa

Odolné PC, Military, TEMPEST, Doprava +420 251 614 073

Základní informace





Main Features


  • Intel Core i7, 2nd generation
  • Quad-core 64-bit processor
  • For CompactPCI 2.0 systems or CompactPCI PlusIO 2.30 hybrid systems (2.0 and CPCI-S.0)
  • Up to 16 GB DDR3 DRAM soldered, ECC
  • microSD card and mSATA slots
  • Front I/O: VGA, 2 Gbit Ethernet, 2 USB
  • Rear I/O: 4 PCIe, 4 USB, 4 SATA, 1 Gbit Ethernet
  • Other I/O (onboard, side card): SATA, SDVO, HDMI/Display Port, HD audio, USB, UART etc.
  • 2.0 to 3.0 GHz Turbo Boost, Hyper-Threading, Active Management Technology
  • Open CL 1.1 support

Specifikace

CPU
  • Intel Core i7-2715QE
    • Up to 2.1 GHz processor core frequency
    • 3 GHz maximum turbo frequency
  • Chipset
    • Intel QM67 Platform Controller Hub (PCH)
Memory
  • Up to 6 MB last level cache integrated in i7
  • Up to 16 GB SDRAM system memory
    • Soldered
    • DDR3 with ECC support
    • 1066/1333/1600 MHz memory bus frequency
  • 64 Mbits boot Flash
  • Serial EEPROM 2kbits for factory settings
Mass Storage
  • microSD card interface
    • Connected via one USB port
  • mSATA disk slot
    • Connected via one SATA channel
  • Serial ATA (SATA)
    • Four channels via rear I/O, one channel via side-card connector, one channel for mSATA disk
    • 4 SATA 3 Gbit/s interfaces, 2 SATA 6 Gbit/s interfaces (rear I/O)
    • RAID level 0/1/5/10 support
Graphics
  • Integrated in QM67 chipset
    • 650 MHz graphics base frequency
    • 1.2 GHz graphics maximum dynamic frequency
  • VGA connector at front panel
  • Two digital display interface ports available via side-card connector
    • DisplayPort, HDMI and SDVO (SDVO only on one interface)
    • One additional DVI connector at front panel optional via side card
    • Simultaneous connection of two monitors
I/O
  • USB
    • Two USB 2.0 ports via Series A connectors at front panel
    • Four USB 2.0 ports via side-card connector
    • Four USB 2.0 ports via rear I/O
    • One USB for connection of microSD
    • UHCI implementation
    • Data rates up to 480 Mbit/s
  • Ethernet
    • Two 10/100/1000Base-T Ethernet channels at the front
    • RJ45 connectors at front panel
    • Ethernet controllers are connected by two x1 PCIe links
    • Onboard LEDs to signal activity status and connection speed
    • One 10/100/1000Base-T Ethernet channel via rear I/O
    • Ethernet controller is connected by one x1 PCIe link
  • High Definition (HD) audio
    • Accessible via side-card connector
Front Connections (Standard)
  • VGA
  • Two USB 2.0 (Series A)
  • Two Ethernet (RJ45)
Rear I/O (PICMG 2.30)
  • Four SATA
  • Four USB
  • One Gigabit Ethernet (second rear interface instead of one front interface as an assembly option)
  • Four PCI Express x1 links
  • Compatible with PICMG 2.30 CompactPCI PlusIO
    • 1PCI33/4PCIE5/2SATA3/2SATA6/4USB2/1(2)ETH1G
Miscellaneous
  • Board controller
  • Real-time clock, buffered by a GoldCap or alternatively a battery (5 years life cycle)
  • Watchdog timer
  • Temperature measurement
  • One user LED
  • Reset button
PCI Express
  • Three x1 links to connect local 1000Base-T Ethernet controllers
    • Data rate 250 MB/s in each direction (2.5 Gbit/s per lane)
  • Four x1 links via rear I/O
    • Data rate up to 500 MB/s in each direction (5 Gbit/s per lane)
  • Three x1 links for extension through side-card connector
    • Data rate up to 500 MB/s in each direction (5 Gbit/s per lane)
CompactPCI Bus
  • Connection via PCI Express link from processor using PCI-Express-to-PCI-Bridge
  • Compliance with CompactPCI Core Specification PICMG 2.0 R3.0
  • System slot
  • 32-bit/33-MHz CompactPCI bus
  • V(I/O): +3.3V (+5V tolerant)
Busless Operation
  • Board can be supplied with +5V only, all other voltages are generated on the board
  • Backplane connectors used only for power supply
Electrical Specifications
Supply voltage/power consumption (board versions with i7-2715QE processor)
  • +5V (-3%/+5%), 9.6 A typ., 14.4 A max.
  • +3.3V (-3%/+5%), 1.8 A (3 Gb Ethernet), 1.4 A (2 Gb Ethernet), 1 A (1 Gb Ethernet)
  • +12V (-10%/+10%), approx. 10 mA
  • If the board is supplied with 5V only (typically without a bus connection), the 3.3V are generated on the board and fed to the backplane (3A max.) No external 3.3 V voltage may be applied in that case!
Mechanical Specifications
  • Dimensions: conforming to CompactPCI specification for 3U boards
  • Front panel: 4HP with ejector
  • Weight: 204 g (w/o heat sink)
Environmental Specifications
  • Temperature range (operation):
    • Depends on system configuration (CPU, hard disk, heat sink...)
    • Maximum: +85°C
    • Minimum: -40°C (all processors)
    • Conditions: airflow 1.5m/s, typical power dissipation: 12 W (board versions with i7-2715QE processor) with Windows XP operating system and 1 Gb Ethernet connection
  • Temperature range (storage): -40..+85°C
  • Relative humidity (operation): max. 95% non-condensing
  • Relative humidity (storage): max. 95% non-condensing
  • Altitude: -300m to + 2,000m
  • Shock: 50 m/s², 30 ms
  • Vibration (Function): 1 m/s², 5 Hz - 150 Hz
  • Vibration (Lifetime): 7.9 m/s², 5 Hz - 150 Hz
  • Conformal coating on request
MTBF
417,879 h @ 40°C according to IEC/TR 62380 (RDF2000)
Safety
PCB manufactured with a flammability rating of 94V-0 by UL recognized manufacturers
EMC
Tested according to EN 55022 (radio disturbance), IEC 61000-4-3 (electromagnetic field immunity), IEC 61000-4-4 (burst) and IEC 61000-4-6 (conducted disturbances)
BIOS
InsydeH2O UEFI Framework
Intel Active Management Technology
  • Manageability Engine in Chipset
  • Network Filters in Chipset
  • Dedicated Flash Storage Area
  • Out of Band (OOB) Access
    • Power off Access
    • Independent of OS status
    • Power status control
    • Keyboard-Video-Mouse (KVM) Viewer (VNC-compatible)
    • IDE-Redirect
    • Serial-over-LAN
Software Support
  • Note that 64-bit hardware technology can be used in an optimal way with 64-bit operating system support
  • Windows
  • Linux
  • VxWorks (on request)
  • QNX (on request)
  • Intel Virtualization Technology, allows a platform to run multiple operating systems and applications in independent partitions; one computer system can function as multiple "virtual" systems
  • For more information on supported operating system versions and drivers see Software.

Volitelné

CPU
  • Intel Core i7-2715QE, 2.1 GHz, 6 MB Cache, 45 W
  • Intel Core i7-2655LE, 2.2 GHz, 4 MB Cache, 25 W
  • Intel Core i7-2610UE, 1.5 GHz, 4 MB Cache, 17 W
  • Intel Core i5-2515E, 2.5 GHz, 3 MB Cache, 35 W
  • Intel Core i3-2340UE, 1.3 GHz, 3 MB Cache, 17 W, no AMT
  • Intel Core i3-2310E, 2.1 GHz, 3 MB Cache, 35 W, no AMT
  • Intel Celeron B810E, 1.6 GHz, 2 MB Cache, 35 W, no AMT
  • Intel Celeron 847E, 1.1 GHz, 2 MB Cache, 17 W, no AMT
  • Intel Celeron 827E, 1.4 GHz, 1.5 MB Cache, 17 W, no AMT
Memory
  • System RAM
    • Up to 16 GB
  • microSD card
    • 0 MB up to maximum available
  • mSATA disk
    • 0 MB up to maximum available
Graphics
One DVI-D connector at front via side card
  • Simultaneous connection of two monitors
I/O
  • Ethernet
    • 9-pin D-Sub connector with one or two 10/100Base-T ports instead of two RJ45 connectors
    • Second Ethernet at rear I/O connector J2 instead of one interface at the front
  • Rear I/O
    • VGA on CompactPCI J2 connector as an assembly option for the conduction-cooled board version
    • VBATT on CompactPCI J1 connector as an assembly option for the conduction-cooled board version
Miscellaneous
TPM (Trusted Platform Module) chip assembled as an option
Mechanical
Side card can be added at left or right side of CPU
Operating Temperature
  • Depends on system configuration (CPU, hard disk, heat sink...)
  • Maximum: +85°C
  • Minimum: -40°C (all processors)
Cooling Concept
Also available with conduction cooling in MEN CCA frame
Some of these options may only be available for large volumes.

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