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SR700-4M-A20X
Military MXM-GPU počítač s provozními teplotami. od -40°C do 70°C
Popis
Odolný počítač SR700-X4M-A20X je výkonný systém vybavený procesorem Intel® Xeon® 9. generace s až 6 jádry a TDP 25 W a integrovanou čipovou sadou, který poskytuje úžasný výkon CPU.
Kromě extrémně odolné konstrukce a vysoké funkčnosti je SR700-X4M-A20X navržen podle norem MIL-STD-810 a IP65 a vyznačuje se vysokou odolností vůči prachu, vlhkosti, nárazům, vibracím, extrémním teplotám a elektromagnetickému rušení.
SR700-X4M-A20X je ideálním řešením pro vojenské účely, jako je obrana, námořní navigace a letecká technologie. Dokáže také odolat a přežít v nejnáročnějších podmínkách s rozšířeným teplotním rozsahem od -40 do 60 °C.
- P65 Rating Military MXM-GPU Fanless Computer
- Counter-Drone visualisation platform incorporating sensor-data fusion
- NVIDIA MXM A2000 8GB RAM, 2560 CUDA
- Intel 9th Gen Coffee Lake(H)® Xeon® ,Core ™ Processor 45W
- PCIe/104 Rugged Expansion Slot for Stackable MXM GPU
- MIL-STD-810 Vibration Method 514.6: ◎Acceleration : 5.0 Grms
- MIL-STD-810 Vibration Method 514.6: ◎PSD : 0.01257 g2/Hz
- MIL-STD-810 Shock Method 516.6 : ◎Wave Form: Half Shine Wave
- MIL-STD-810 Shock Method 516.6 : ◎Acceleration: 75G
- MIL-STD-810 Temperature Method 501.5 502.5: ◎ Operating Temp High 70°C
- MIL-STD-810 Temperature Method 501.5 502.5: ◎ Operating Temp Low -40°C
Specifikace
| High Power Processor | Intel® Core™ i7-9850HE, 45W, Coffee Lake 9th Gen, 6C, Freq. 2.7/4.4 GHz, 9M Cache Intel® Core™ i7-9850HL, 25W, Coffee Lake 9th Gen, 6C, Freq. 1.9/4.1 GHz, 9M Cache Intel® Xeon® E-2276ME, 45W, Coffee Lake 9th Gen, 6C, Freq. 2.8/4.5 GHz, 12M Cache Intel® Xeon® E-2276ML, 25W, Coffee Lake 9th Gen, 6C, Freq. 2.0/4.2 GHz, 12M Cache |
| Chipset | CM246 |
| memory type | 4 x DDR4 2666 MHz SO-DIMM up to 128GB |
| Graphic | Quadro® RTX A2000 CUDA 2560 GDDR6-4/8GB |
| Ethernet | I219LM +I210iT |
| Audio codec | ALC887 |
| Power Type | DC-DC 9V~36V, Options for MIL-STD 461 18V~36V DC |
| Storage | 1x 2TB M.2 2280 NVMe SSD 1x 2TB SATA III 2.5” SSD |
| M.2 | 1 x M.2 (M-key, type:2280, SATA/PCIe 3.0x4 NVMe) |
| Mini-PCI | 2 x Full size (PCIe x1,USB 2.0 and micro SIM Card) |
| Front I/O | X1: DC-IN with DTL38999 connector X2: 2 x USB2.0 with DTL38999 connector X3: 1 x 1GbE LAN with DTL38999 connector X4: 1 x 1GbE LAN withDTL38999 connectors X5: 1 x RS232/485 with DTL38999 connector X6: 1 x mDP with DTL38999 connector |
| Applications | Military Platforms Requiring Compliance to MIL-STD-810 where Harsh Temperature, Shock, Vibration, Altitude, Dust and EMI Conditions. |
| Operating System | Windows 10 32/64Bit |
| Ubuntu13.04, Ubuntu13.10, Ubuntu14.04, Fedora 20 | |
| Dimension | 360 x 230 x 86 mm (WxDxH) |
| Weight | 8.6 Kg ( 18.9 lbs ) |
| Chassis | Aluminum Alloy, Corrosion Resistant |
| Heatsink | Aluminum Alloy, Corrosion Resistant |
| Finish | Anodic aluminum oxide ( Color Iron gray ) |
| Cooling | Natural Passive Convection/Conduction. No Moving Parts. |
| Connectors | IP65 Waterproof Connectors |
| Ingress Protection | IP65 |
| Operating Temp | -40°C to 60°C |
| Storage Temp. | -40°C to 85°C |
| Relative Humidity | 5% to 95%, non-condensing |
| MIL-STD-810 | Method 507.5, Procedure II ( Temperature & Humidity ) Method 516.6 Shock-Procedure V Non-Operating ( Mechanical Shock ) Method 516.6 Shock-Procedure I Operating ( Mechanical Shock ) Method 514.6 Vibration Category 24/Non-Operating ( Category 20 & 24, Vibration ) Method 514.6 Vibration Category 20/Operating ( Category 20 & 24, Vibration ) Method 501.5, Procedure I ( Storage/High Temperature ) Method 501.5, Procedure II ( Operation/High Temperature ) Method 502.5, Procedure I ( Storage/Low Temperature ) Method 502.5, Procedure II ( Operation/Low Temperature ) Method 503.5, Procedure I ( Temperature shock ) |
| Reliability | No Moving Parts; Passive Cooling. |
| Designed & Manufactured using ISO 9001 / 2000 Certified Quality Program. | |
| Green Product | RoHS, WEEE compliance |
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