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SR100-X3
Intel® QM175 MIL-STD Fanless Rugged System with Intel® Core™ i7 Kaby Lake Processor, 9V to 36V DC-in, Wide Temp. -40°C to 70°C
Základní informace
- Intel® Core™ i7-7820EQ (3.0 GHz, up to 3.7 GHz, 4-cores, 8 threads)
- SO-DIMM up to 32 GB RAM
- mSATA 512GB
- Multi-Displays by 2 x DP, 1 x DVI-I
- 1 x mPCIe Expansion slot (One Co-Layout with mSATA)
- 2 x PCIe Intel® Gigabit Ethernet
- 4 x USB 3.0, 1 x COM ports
- 9V-36V DC-in with power delay on/off
- Extended Temperature -40°C to 70°C
The SR100-X3 based on Intel® KabyLake QM175 chipset, is powered by Intel® 7th generation Core™ i7/i5/i3 processor onboard. The SR100-X3 can operate effectively in harsh environment under temp range from -40°C to 70°C and is a perfect solution for military, transportation, factory automation and digital signage applications. SR100-X3 is based on EBX form factor which features with stackable PCIe/104 and FPE expansions, on board Nano SATA(3.0)16/32 Giga Byte SSD and SO-DIMM up to 32GB. It supports triple-display, 2 DP and 1 DVI-I, 2 GIGA LAN port, 4 USB 3.0, 1 COM port and 2 mPCIe Expansion slots (one co-layout with mSATA). SR100-X3 supplies wide power voltage from 9V to 36V DC-in.
Specifikace
| CPU | Intel® Core™ i7 KabyLake , BGA type Intel® Core i7-7820EQ (4C x 3.4/2.4 GHz GHz), 6M Cache (45W) |
| CHIPSET | Intel® QM175 PCH |
| MEMORY TYPE | 1 x DDR4 1 SO-DIMM up to 32 GB with ECC |
| EXPANSION SLOT | 2 x mPCIe (1 x colay with mSATA) for GEN2 |
| STORAGE DEVICE | mSATA 512GB |
| ETHERNET CHIPSET | Intel® I210IT & i217LM GbE |
| POWER BUTTON | 1 with backlight |
| POWER LED | 1 |
| HDD LED | 1 |
| LAN LED | 2 sets |
| USB | 2 x USB 3.0 |
| POWER | 1 x Terminal Block |
| DISPLAYPORT | 2 x 20-pin DP connector (female) |
| DVI-I | 1 x 29-pin DVI-D connector (female) |
| ETHERNET | 2 x RJ45 ports |
| AUDIO | Mic-in, Line-out |
| COM | 2x RS-232/422/485 ports, Jumper-selectable (DB9 male) Serial Signals: RS232: DCD-, RXD, TXD, DTR-, GND, DSR-, RTS-, CTS- RS422: TX-, RX+, TX+, RX-, GND RS485- 4W: TxD+, TxD-, RxD+, RxD-, GND RS485- 2W: DATA-, DATA+, GND |
| AUDIO | 1 x MIC, 1 x Line out |
| USB | 2 x USB 3.0 |
| DISPLAY INTERFACE | DVI-I interface x 1: 29-pin DVI-I connectors(female); resolution up to 1920 x 1200@60 Hz Display port interface x 2: 20-pin display port connectors (female); resolution up to 3840 x 2160@60 Hz |
| GRAPHICS CONTROLLER | Onboard Intel® HD 4600 graphics |
| OS SUPPORT LIST | Windows 8 x32/x64、Windows 8.1 x32/x64、Windows 10 x32/x64 Fedora 20、Ubuntu 13.04、Ubuntu 13.10、Ubuntu 14.04 |
| POWER REQUIREMENT | 9V to 36V DC-in, AT/ATX mode with power delay on/off |
| DIMENSION | 250 x 149 x 76 mm |
| OPERATING TEMP. | -40 to 70°C(ambient with air flow) |
| STORAGE TEMP. | -40 to 85°C |
| RELATIVE HUMIDITY | 5% to 95%, non-condensing |
| MIL-STD-810G TEST | Method 507.5, Procedure II (Temperature & Humidity) Method 516.6 Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6 Shock-Procedure I Operating (Mechanical Shock) Method 514.6 Vibration Category 24/Non-Operating (Category 20 & 24, Vibration) Method 514.6 Vibration Category 20/Operating (Category 20 & 24, Vibration) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) |
| EMC | CE and FCC compliance |
| GREEN PRODUCT | RoHS, WEEE compliance |
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