CZ
EN
nROK 7252-WI2-C8S
Fanless Rolling Stock Computer with Intel® 8th/9th Gen Core™/Xeon® CPU
Základní informace
- ntel® Coffee Lake S/Refresh 8th/9th Gen Core™/Xeon® LGA1151 socket-type CPU
- Six SIM cards + three WWAN modules support
- LTE/5G WWAN module support
- 2 x External SSD for RAID 0, 1, 5, 10 (compatible with 15mm disk)
- 2 x mSATA (occupied mini-PCIe slot)
- EN 50155, class OT4 conformity
- Three video outputs, one VGA and two HDMI
- 3 x mini-PCIe + 2 x M.2 socket expansion
- 1 x SD card for exporting and backing up data
- Wide voltage input 24~110VDC (w/ isolation)
- Up to 3-sec protection against temporary voltage dips
NEXCOM system nROK 7252 accomplishes operational efficiency of public transportation and service. Based on Intel® Coffee Lake S/Refresh 8th/9th Gen Core™/Xeon® LGA1151 socket-type CPU and 8-port 802.3 af/at PoE, it provides an integral solution incorporating high computing power. with dual SIM cards per modem support, it allows six SIM cards backup each other for a better connectivity quality by software. In addition, six SIM cards and three WWAN modules architecture can increase the bandwidth for a faster data transmission speed. RAID 0, 1, 5, 10 guarantees the safety of data in the 2 x external SSD. nROK 7252 keeps the flexibility to meet the demand for different rolling stock applications, such as infotainment, transportation cellular router, video server, and video surveillance.
Specifikace
| CPU | Support 9th/8th generation Intel® Core™ i7/i5/i3, Xeon® LGA1151 socket - Intel® Core™ i7-9700TE/i7-8700T, TDP 35W - Intel® Core™ i5-9500TE/i5-8500T, TDP 35W - Intel® Core™ i3-9100TE/i3-8100T, TDP 35W - Intel® Xeon® E-2278GEL, TDP 35W - Intel® Celeron® G4900T, TDP 35W |
| Chipset | Intel® C246 platform controller hub |
| Memory | 2 x 260-pin DDR4 SO-DMIM sockets up to 32GB/channel (64GB for two channels) |
| Video Output | Chipset Intel® UHD graphics 630 2 x HDMI 1.4b up to 4096 x 2160 @ 30Hz 1 x VGA up to 1920 x 1200 @ 60Hz |
| Storage | 2 x 2.5” SATA 3.0 external SSD (15mm) 2 x mSATA (occupied mini-PCIe slot) 1 x Removable SD 3.0 |
| Expansion | 1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA) 1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA), BOM optional M.2 3042 Key B socket (USB 2.0, USB 3.1 Gen 1) for LTE/5G NR module with 2 x external SIM 1 x Full size mini-PCIe socket (USB 2.0, USB 3.1 Gen 2 (BOM optional)) for LTE module, BOM optional M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen 2, PCIe 3.0 (BOM optional)) for LTE/5G NR module with 2 x external SIM 2 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen 2, PCIe 3.0 (BOM optional)) for LTE/5G NR module with 2 x external SIM |
| GNSS and Onboard Sensor | 1 x Default U-blox NEO-M8N GNSS module for GPS/Glonass/QZSS/Galileo/BeidouOptional M8U modules with dead reckoning available G Sensor (3-axis, 10-bit resolution) |
| LAN and Power over Ethernet | 2-Port LAN M12 X-coded, 10/100/1000 Mbps Intel® I210/I219 (support iAMT) GbE 8-Port LAN M12 X-coded, 10/100/1000 Mbps Ethernet Switch GbE, PoE 802.3af/at, max. 60W |
| Security | TPM 2.0: Infineon SLB9665TT2.0FW5.62 (BOM optional) |
| I/O Interface-Front | 24 x LED indicators (including 3 x programmable LED) 2 x HDMI 1.4b 1 x VGA 1 x USB 3.1 Gen 2 type A (5V/1A) 1 x USB 3.1 Gen 1 type A (5V/1A) 6 x Externally accessible SIM card sockets with cover 2 x 2.5” removable SSD tray 1 x SD with cover 1 x Reset button 1 x Power button 10 x SMA antenna |
| I/O Interface-Rear | 2 x LAN M12 X-coded, I210/I219 10/100/1000 Mbps 8 x PoE 802.3af/at (max. 60W), M12 X-coded 1 x Mic-in, 2 x Line-out (AUDIO, DB9, female) 1 x M12 A-coded connector for 2 x USB 2.0 2 x USB 3.1 (5V/1A) type A 2 x DB9 (COM1/COM2) for full RS232 (isolation) 1 x DB9 (COM3) for full RS232/422/485 (isolation) 1 x DB15 (CAN/DIO) - 1 x Isolated CANBus 2.0B - 4 x DI and 4 x DO (isolation) - Power in for DIO isolation, 9~48VDC 1 x Waterproof DC input connector with ignition - 24~110VDC (w/ isolation) 3 x SMA antenna |
| Power Management & Software Support | Power input 24~110VDC w/ isolation 1.65~3-sec (250W~120W) protection against temporary voltage dips Selectable boot-up & shut-down voltage for low power protection by software Setting 8-level power on/off delay time by software Support S3/S4 suspend mode10~255 seconds WDT support, setup by software SDK (Windows/Linux) including utility and sample code |
| Operating System | Windows 10/Linux |
| Dimensions | 260 x 266 x 110 (W x D x H) (mm) |
| Weight | 7.6kg |
| Environment | Operating temperatures: EN 50155, class OT4 -40~70°C, 85°C for 10 minutes (w/ industrial SSD) with air flow Storage temperatures: -40°C to 80°C Relative humidity: 90% (non-condensing) Vibration (random) - 2g@5~500 Hz (in operation, SSD) Vibration (SSD) - Operating: MIL-STD-810G, Method 514.6, Category 4, common carrier US highway truck vibration exposure - Storage: MIL-STD-810G, Method 514.6, Category 24, minimum integrity test Shock (SSD) - Operating: MIL-STD-810G, Method 516.6, Procedure I, functional shock=40g - Non-operating: MIL-STD-810G, Method 516.6, Procedure V, crash hazard shock test=75g |
| Certifications | CE FCC Class A EN 50155: 2017 - Ambient temperature EN 50155, Class OT4 (-40~70°C), 85°C for 10 minutes - Interruptions of voltage supply class S1, S2 - Supply change over class C1, C2 - EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019 - Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30 - Shock and vibration IEC 61373 Class B - Protective coating class PC1 (PC2, by request) EN 45545-2: 2013+A1:2015 |
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