nROK 7252-AC8S

Fanless Rolling Stock Computer with Intel® 8th/9th Gen Core™/Xeon® CPU

Petr Chalupa

Petr Chalupa

Odolné PC, Military, TEMPEST, Doprava +420 251 614 073

Základní informace

  • Intel® Coffee Lake S/Refresh 8th/9th Gen Core™/Xeon® LGA1151 socket-type CPU
  • Six SIM cards + three WWAN modules support
  • LTE/5G WWAN module support
  • 4 x External SSD for RAID 0, 1, 5, 10 (compatible with 15mm disk)
  • 2 x mSATA (occupied mini-PCIe slot)
  • EN 50155, class OT4 conformity
  • Three video outputs, one VGA and two HDMI
  • 3 x mini-PCIe + 2 x M.2 socket expansion
  • 1 x SD card for exporting and backing up data

NEXCOM system nROK 7252 accomplishes operational efficiency of public transportation and service. Based on Intel® Coffee Lake S/Refresh 8th/9th Gen Core™/Xeon® LGA1151 socket-type CPU and 8-port 802.3 af/at PoE, it provides an integral solution incorporating high computing power. with dual SIM cards per modem support, it allows six SIM cards backup each other for a better connectivity quality by software. In addition, six SIM cards and three WWAN modules architecture can increase the bandwidth for a faster data transmission speed. RAID 0, 1, 5, 10 guarantees the safety of data in the 4 x external SSD. nROK 7252 keeps the flexibility to meet the demand for different rolling stock applications, such as infotainment, transportation cellular router, video server, and video surveillance.

Specifikace

CPU Support 9th/8th generation Intel® Core™ i7/i5/i3, Xeon® LGA1151 socket
- Intel® Core™ i7-9700TE/i7-8700T, TDP 35W
- Intel® Core™ i5-9500TE/i5-8500T, TDP 35W
- Intel® Core™ i3-9100TE/i3-8100T, TDP 35W
- Intel® Xeon® E-2278GEL, TDP 35W
- Intel® Celeron® G4900T, TDP 35W
Chipset Intel® C246 platform controller hub
Memory 2 x 260-pin DDR4 SO-DMIM sockets up to 32GB/channel (64GB for two channels)
Video Output Chipset Intel® UHD graphics 630
2 x HDMI 1.4b up to 4096 x 2160 @ 30Hz
1 x VGA up to 1920 x 1200 @ 60Hz
Storage 4 x 2.5” SATA 3.0 external SSD (15mm)
2 x mSATA (occupied mini-PCIe slot)
1 x Removable SD 3.0
Expansion 1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA)
1 x Full size mini-PCIe socket (USB 2.0, PCIe 3.0/SATA), BOM optional M.2 3042 Key B socket (USB 2.0, USB 3.1 Gen 1) for LTE/5G NR module with 2 x external SIM
1 x Full size mini-PCIe socket (USB 2.0, USB 3.1 Gen 2 (BOM optional)) for LTE module, BOM optional M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen 2, PCIe 3.0 (BOM optional)) for LTE/5G NR module with 2 x external SIM
2 x M.2 3042/3050/3052 Key B socket (USB 2.0, USB 3.1 Gen 2, PCIe 3.0 (BOM optional)) for LTE/5G NR module with 2 x external SIM
GNSS and Onboard Sensor 1 x Default U-blox NEO-M8N GNSS module for GPS/Glonass/QZSS/Galileo/BeidouOptional M8U modules with dead reckoning availableG Sensor (3-axis, 10-bit resolution)
LAN and Power over Ethernet 2-Port LAN M12 X-coded, 10/100/1000 Mbps Intel® I210/I219 (support iAMT) GbE8-Port LAN M12 X-coded, 10/100/1000 Mbps Ethernet Switch GbE, PoE 802.3af/at, max. 60W
Security TPM 2.0: Infineon SLB9665TT2.0FW5.62 (BOM optional)
I/O Interface-Front 24 x LED indicators (including 3 x programmable LED)
2 x HDMI 1.4b
1 x VGA
1 x USB 3.1 Gen 2 type A (5V/1A)
1 x USB 3.1 Gen 1 type A (5V/1A)
6 x Externally accessible SIM card sockets with cover
4 x 2.5” removable SSD tray
1 x SD with cover
1 x Reset button
1 x Power button
10 x SMA antenna
I/O Interface-Rear 2 x LAN M12 X-coded, I210/I219 10/100/1000 Mbps
8 x PoE 802.3af/at (max. 60W), M12 X-coded
1 x Mic-in, 2 x Line-out (AUDIO, DB9, female)
1 x M12 A-coded connector for 2 x USB 2.02 x USB 3.1 (5V/1A) type A
2 x DB9 (COM1/COM2) for full RS232 (isolation)
1 x DB9 (COM3) for full RS232/422/485 (isolation)
1 x DB15 (CAN/DIO)
- 1 x Isolated CANBus 2.0B
- 4 x DI and 4 x DO (isolation)
- Power in for DIO isolation, 9~48VDC
1 x Waterproof DC input connector with ignition
- DC 24V/36V (w/o isolation)
3 x SMA antenna
Power Management & Software Support power input 24VDC/36VDC w/o isolation
Selectable boot-up & shut-down voltage for low power protection by software
Setting 8-level power on/off delay time by software
Support S3/S4 suspend mode
10~255 seconds WDT support, setup by software
SDK (Windows/Linux) including utility and sample code
Operating System Windows 10/Linux
Dimensions 260 x 266 x 110 (W x D x H) (mm)
Weight 6.8kg
Environment Operating temperatures: EN 50155, class OT4 -40~70°C, 85°C for 10 minutes (w/ industrial SSD) with air flow
Storage temperatures: -40°C to 80°C
Relative humidity: 90% (non-condensing)
Vibration (random)
- 2g@5~500 Hz (in operation, SSD)
Vibration (SSD)
- Operating: MIL-STD-810G, Method 514.6, Category 4, common carrier US highway truck vibration exposure
- Storage: MIL-STD-810G, Method 514.6, Category 24, minimum integrity test
Shock (SSD)
- Operating: MIL-STD-810G, Method 516.6, Procedure I, functional shock=40g
- Non-operating: MIL-STD-810G, Method 516.6, Procedure V, crash hazard shock test=75g
Certifications CE
FCC Class A
EN 50155: 2017
- Ambient temperature EN 50155, Class OT4 (-40~70°C), 85°C for 10 minutes
- Interruptions of voltage supply class S1
- Supply change over class C1, C2
- EMC EN 50121-1: 2017, EN 50121-3-2: 2016+A1: 2019
- Environment EN 60068-2-1, EN 60068-2-2, EN 60068-2-30
- Shock and vibration IEC 61373 Class B
- Protective coating class PC1 (PC2, by request)
EN 45545-2: 2013+A1:2015

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