XM1L ESMexpress COM Intel Atom XL

XM1L - ESMexpress® COM with Intel® Atom™ XL - RSE, Rugged System-On-Module Express (ANSI-VITA 59 in process) - Intel® Atom™ Z510P, Z530P, Z510PT, Z520PT - Up to 2 GB DDR2 SDRAM - Up to 2 PCI Express® - Up to 1 Gb Ethernet - 1 SATA port - 8 U

Petr Chalupa

Petr Chalupa

Odolné PC, Military, TEMPEST, Doprava +420 251 614 073


The XM1L is a Computer-On-Module of the ESMexpress® family in accordance with a proposed ANSI standard currently under development (ANSI-VITA 59, RSE Rugged System-On-Module Express). Together with an application-specific carrier board it forms a semi-custom solution for industrial, harsh, mobile and mission-critica The XM1L is controlled by the Intel® Atom™ XL processor, an IA-32 core based on 45nm process technology which is qualified for the industrial temperature range. Due to the power architecture of the Intel® Atom™ CPU, the XM1L has a total power consumption of max. 5 to 7 Watts, while having a clock frequency of up to 1.6 GHz. The XM1L accommodates up to 2 GB of directly soldered main memory and supports other memory like USB Flash on the carrier board. Interfaces from the Intel® System Controller Hub US15WP are optimized using exclusively modern serial standards and are all routed from the XM1L for availability on any ESMexpress® carrier board. Depending on the version of XM1L, those interfaces include a combination of PCI Express® links, LVDS, SDVO, high-definition audio, SATA, Ethernet with wake-on-LAN functionality, and USB. Additional COM interfaces can be made available on the carrier board via USB to COM conversion. The XM1L is completed by a board management controller for temperature and power supervision. It comes with a Phoenix® Award BIOS configurable for the final application. The XM1L is screened or qualified for operation from -40°C to +85°C (Tcase). As all ESMexpress® modules it is embedded in a covered frame. This ensures EMC protection and allows efficient conductive cooling. Air cooling is also possible by applying a heat sink on top of the cover. Where operation temperatures are moderate, the module may even do without the frame and cover, with a suitable low-power processor and airflow. ESMexpress® modules are firmly screwed to a carrier board and come with rugged industry-proven connectors supporting high frequency and differential signals. Only soldered components are used to withstand shock and vibration, and the design is optimized for conformal coating. All ESMexpress® modules support a single 95x125mm form factor. For evaluation and development purposes an ATX carrier board is available. The ESMexpress® module can be evaluated on a COM Express™ carrier board via an adapter from ESMexpress® to COM Express™.



Hledáte technologického partnera? Neváhejte se na nás obrátit.

šipka nahoru