G23 - 3U CompactPCI Serial Intel Core i7 CPU Board

3U CompactPCI Serial The G23 is a versatile 4HP/3U single-board computer supporting a multitude of modern serial interfaces according to the CompactPCI Serial standard. It is thus perfectly suited for data-intensive applications which require high comp

Petr Chalupa

Petr Chalupa

Odolné PC, Military, TEMPEST, Doprava +420 251 614 073

Základní informace

Main Features

  • Intel Core i7, 4th generation
  • Quad-core 64-bit processor
  • 4 HP system master and peripheral slot
  • PICMG CPCI-S.0 CompactPCI Serial
  • Up to 16 GB DDR3 DRAM soldered, ECC
  • mSATA and microSD card slots
  • Standard front I/O: 2 DisplayPorts, 2 Gb Ethernet, 2 USB 3.0
  • Standard rear I/O: 7 PCIe, 8 USB 2.0, 2 USB 3.0, 5 SATA, DisplayPort/HDMI
  • Rear I/O via mezzanine board: up to 8 Gigabit Ethernet
  • Intel Turbo Boost, Hyper-Threading, AMT 9.0
  • Open CL support

Specifikace

CPU
  • Intel Core i7-4700EQ
    • 2.4 GHz processor core frequency
    • 3.4 GHz maximum turbo frequency
  • Chipset
    • QM87 Platform Controller Hub (PCH)
Board Management Controller
  • Power supervision and watchdog
  • Temperature measurement
  • 2 board status LEDs
  • 2 user LEDs
  • Reset button
Memory
  • 6 MB last level cache integrated in i7 processor
  • Up to 16 GB SDRAM system memory
    • Soldered
    • DDR3 with ECC support
    • Up to 1600 MHz memory bus frequency
  • 64 Mbits boot Flash
  • Serial EEPROM 2 KB for factory settings
  • mSATA disk slot
    • Connected via one SATA port from the PCH
  • Serial GPIO (SGPIO)
    • One interface via CPCI-S.0 rear connector
    • Compliant with SFF 8485 specification
  • One microSD card slot
    • Via USB
Mass Storage
Serial ATA (SATA)
  • Five channels via rear I/O (six if the link to the mSATA disk is not required, can be switched in BIOS)
  • Six ports with transfer rates up to 6 Gbit/s (SATA Revision 3.x)
  • RAID level 0/1/5/10 support
  • Hot-plug together with G501
Graphics
  • Integrated in QM87 chipset
    • Maximum resolution: up to 2560x1600
  • Two DisplayPort connectors at front panel
    • Optionally two DVI/HDMI ports via external adapter
  • One DisplayPort at CPCI-S.0 rear connector
    • Optionally SDVO or DVI/HDMI port
I/O
  • USB 2.0
    • Up to eight USB 2.0 host ports via CPCI-S.0 rear connector (depending on the number of used USB 3.0 ports)
    • Two USB 2.0 host ports for connection of the rear I/O card
    • EHCI implementation
    • Data rates up to 480 Mbit/s
  • USB 3.0
    • Two USB 3.0 host ports via Series A connector at front panel
    • Two USB 3.0 host ports via CPCI-S.0 rear connector
    • Data rate up to 5 Gbit/s
  • Ethernet
    • Two 10/100/1000Base-T Ethernet channels at the front
    • RJ45 connectors at front panel
    • Ethernet controllers are connected by two x1 PCIe links
    • Two LEDs to signal LAN link, activity status and connection speed
Front Connections
  • Two DisplayPort
  • Two USB 3.0 (Series A)
  • Two Ethernet (RJ45)
Rear I/O
  • 5 SATA (6 switchable in BIOS)
  • 1 DisplayPort
  • 8 USB 2.0
  • 2 USB 3.0
  • 5 PCI Express x1 links
  • 2 PEG x8 links
  • SGPIO
PCI Express
  • Two x8 PCI Express graphics links via CPCI-S.0 rear connector
    • Data rate 985 MB/s (8 Gbit/s per lane)
  • Five x1 PCIe links via CPCI-S.0 rear connector
    • Data rate 500 MB/s (5 Gbit/s per lane)
  • Two x1 PCIe links to connect local 1000Base-T Ethernet controllers
    • Data rate 250 MB/s (2.5 Gbit/s per lane)
  • One x1 PCIe link via for connection of the rear I/O card
    • Data rate 500 MB/s (5 Gbit/s per lane)
Miscellaneous
Real-time clock with supercapacitor backup, battery-buffered
CompactPCI Serial
  • Compliance with CompactPCI Serial PICMG CPCI-S.0 Specification
  • System or peripheral slot
Electrical Specifications
Supply voltage/power consumption:
  • +12V (9..16V), tbd A nominal, tbd A maximum
  • +5V (-5%/+5%) standby voltage optional
Mechanical Specifications
  • Dimensions: conforming to CompactPCI Serial specification for 3U boards
  • Front panel: 4HP with ejector
  • Weight:
    • 208 g (w/o heat sink)
    • 398 g (with heat sink and mSATA adapter)
Environmental Specifications
  • Temperature range (operation):
    • Depends on system configuration (CPU, hard disk, heat sink...)
    • Maximum: +85°C
    • Minimum: -40°C (all processors)
    • Airflow: min. 1.5 m/s, typical power dissipation tbd, with Windows XP operating system, 1 Gb Ethernet, without CPU clock reduction
  • Temperature range (storage): -40..+85°C
  • Relative humidity (operation): max. 95% non-condensing
  • Relative humidity (storage): max. 95% non-condensing
  • Altitude: -300 m to + 3,000 m
  • Shock: 50 m/s², 30 ms
  • Vibration (function): 1 m/s², 5 Hz - 150 Hz
  • Vibration (lifetime): 7.9 m/s², 5 Hz - 150 Hz
  • Conformal coating on request
MTBF
tbd h @ 40°C according to IEC/TR 62380 (RDF 2000)
Safety
  • Flammability
    • UL 94V-0
  • Electrical Safety
    • Insulation measurement test according to EN 50155 (12.2.9.1)
    • Voltage withstand test according to EN 50155 (12.2.9.2)
    • Information technology equipment test according to EN 60950
EMC Conformity
  • EN 55022 (radio disturbance)
  • IEC 61000-4-2 (ESD)
  • IEC 61000-4-3 (electromagnetic field immunity)
  • IEC 61000-4-4 (burst)
  • IEC 61000-4-5 (surge)
  • IEC 61000-4-6 (conducted disturbances)
BIOS
InsydeH2O UEFI Framework
Intel Active Management Technology
  • Out of Band (OOB) Access
    • Power off Access
    • Independent of OS status
    • Power status control
    • Keyboard-Video-Mouse (KVM) Viewer (VNC-compatible)
    • IDE-Redirect
    • Serial-over-LAN
  • Manageability Engine in Chipset
  • Network Filters in Chipset
  • Dedicated Flash Storage Area
Software Support

Volitelné

CPU
Memory
  • System RAM
    • 4 GB, 8 GB or 16 GB
  • mSATA disk
    • 0 MB up to maximum available
  • microSD card
    • 0 MB up to maximum available
I/O
Ethernet
  • One Gigabit Ethernet on M12 connector instead of two interfaces on RJ45
Rear I/O
  • PCI Express
    • 8 PCI Express lanes
  • Ethernet
    • Up to eight Gigabit Ethernet interfaces on the backplane using rear I/O card (e.g. GM1)
Operating Temperature
  • Depends on system configuration (CPU, hard disk, heat sink...)
  • Maximum: +85°C
  • Minimum: -50°C
Cooling Concept
Also available with conduction cooling in MEN CCA frame
Some of these options may only be available for large volumes.

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