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F23P - Intel Core i7 4th gen CPU Board

3U CompactPCI PlusIO The F23P 4HP/3U CPU board is compatible to the CompactPCI Plus IO standard and equipped with the 4th generation Intel Core i7 4700EQ processor and the QM87 platform controller hub.

Petr Chalupa

Petr Chalupa

Odolné PC, Military, TEMPEST, Doprava +420 251 614 073

Základní informace




Main Features


  • Intel Core i7, 4th generation
  • Quad-core 64-bit processor
  • For CompactPCI 2.0 systems or CompactPCI PlusIO 2.30 hybrid systems (2.0 and CPCI-S.0)
  • Up to 16 GB DDR3 DRAM soldered, ECC
  • microSD card and mSATA slots
  • Front I/O: VGA, 2 Gbit Ethernet, 2 USB
  • Rear I/O: 4 PCIe, 4 USB, 4 SATA, 1 Gbit Ethernet
  • Other I/O (onboard, side card): SATA, HDMI/Display Port, HD audio, USB, UART etc.
  • 2.4 to 3.4 GHz Turbo Boost, Hyper-Threading, Active Management Technology
  • Open CL support

Specifikace

CPU
Chipset
QM87 Platform Controller Hub (PCH)
Memory
  • System Memory
    • Soldered DDR3, ECC support
    • 4 GB, 8 GB, or 16 GB
  • Boot Flash
    • 16 MB
Mass Storage
The following mass storage devices can be assembled:
  • microSD card
  • mSATA disk
Graphics
  • Integrated in QM87 chipset
  • Maximum resolution: 1920x2000 pixels
  • 24-bit color at 60 Hz (reduced blanking)
  • Simultaneous connection of two monitors
Front Interfaces
  • Video
    • One VGA connector
    • Additional interfaces are available via a side card
  • USB
    • Two Series A connectors, USB 2.0 (480 Mbit/s)
  • Ethernet
    • Two RJ45 connectors, 1000BASE-T (1 Gbit/s), or
    • One RJ45 connector, 1000BASE-T (1 Gbit/s), or
    • One 9-pin D-Sub connector, two 100BASE-T (100 Mbit/s), or
    • Two M12 connectors on 8 HP, two 1000BASE-T (1000 Mbit/s)
    • One front channel can optionally be led to the backplane
    • Two link and activity LEDs per channel
  • Front-panel LED for board status
  • Reset button
Rear Interfaces
  • Compatible with PICMG 2.30 CompactPCI PlusIO
    • 1PCI33/4PCIE5/4SATA6/4USB2/1ETH1G, or
    • 1PCI33/4PCIE5/4SATA6/4USB2/2ETH1G
  • SATA
    • Four channels, SATA Revision 3.x (6 Gbit/s), RAID level 0/1/5/10 support
  • USB
    • Four channels, USB 2.0 (480 Mbit/s)
  • Ethernet
    • One channel, 1000BASE-T (1 Gbit/s), or
    • Two channels, 1000BASE-T (1 Gbit/s)
    • One front channel can optionally be led to the backplane
  • PCI Express
    • Four x1 links (500 MB/s per link), PCIe 2.x (5 Gbit/s per lane)
    • One x4 link (2 GB/s per link), PCIe 2.x (5 Gbit/s per lane)
Onboard Interfaces
  • An onboard connector allows a side card to be plugged onto the CPU board to add front panel connections or mass storage devices. A range of standard side cards is available to implement different functions.
  • DisplayPort/HDMI
    • Two channels
  • HD Audio
    • One channel
  • SATA
    • One channel, SATA Revision 2.x (3 Gbit/s), RAID level 0/1/5/10 support
  • USB
    • Four channels, USB 2.0 (480 Mbit/s)
  • PCI Express
    • Three x1 links (500 MB/s per link), PCIe 2.x (5 Gbit/s per lane)
Supervision and Control
  • Board controller
  • Watchdog timer
  • Temperature measurement
  • Real-time clock with supercapacitor or battery backup
    • Data retention of supercapacitor: tbd
  • Intel Active Management Technology
Backplane Standard
CompactPCI Core Specification PICMG 2.0 R3.0
  • System slot
  • 32-bit/33 or 66-MHz CompactPCI bus
  • V(I/O): +3.3V (+5V tolerant)
  • The board can be supplied with +5V only, all other voltages are generated on the board. The backplane connectors are used for power supply only.
Electrical Specifications
  • Supply voltages
    • +5 V (-3%/+5%)
    • +3.3 V (-3%/+5%)
    • +12 V (-10%/+10%)
  • Power consumption
    • The following values are valid for product model 02F023P00, which uses a tbd processor.
    • +5V: tbd A typ., tbd A max.
    • +3.3V: tbd A (3 Gb Ethernet), tbd A (2 Gb Ethernet), tbd A (1 Gb Ethernet)
    • +12V: approx. tbd mA
Mechanical Specifications
  • Dimensions
    • 3U, 4 HP, or
    • 3U, 8 HP
  • Weight: 388 g (model 02F023P00)
Environmental Specifications
  • Temperature range (operation)
    • -40°C to +85°C (model 02F023P00)
    • 0°C to +60°C (model 02F023P01)
    • Airflow 1.5 m/s
    • Depends on system configuration (CPU, hard disk, heat sink...)
  • Temperature range (storage): -40°C to +85°C
  • Cooling concept
    • Air-cooled
    • Conduction-cooled in MEN CCA frame
  • Relative humidity (operation): max. 95% non-condensing
  • Relative humidity (storage): max. 95% non-condensing
  • Altitude: -300 m to +2000 m
  • Shock: 50 m/s², 30 ms
  • Vibration (Function): 1 m/s², 5 Hz to 150 Hz
  • Vibration (Lifetime): 7.9 m/s², 5 Hz to 150 Hz
Reliability
MTBF: 549 414 h @ 40°C according to IEC/TR 62380 (RDF2000) (model 02F023P00)
Safety
Flammability
  • UL 94V-0
EMC
  • EN 55022 (radio disturbance)
  • IEC 61000-4-2 (ESD)
  • IEC 61000-4-3 (electromagnetic field immunity)
  • IEC 61000-4-4 (burst)
  • IEC 61000-4-5 (surge)
  • IEC 61000-4-6 (conducted disturbances)
Software Support

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