CZ
EN
AV600-TH-A10H
Military IP66 Mission GPU Box PC
Popis
AV600-TH je poháněn procesory Intel® 11 Gen. Tiger Lake-H Xeon. Tyto procesory jsou vyráběny nejmodernější a optimalizovanou 14nm technologií Intel a mají až 8 jader CPU. Nabízejí vysoký výpočetní výkon a flexibilitu pro náročnější úlohy IoT. Procesory řady H jsou ideální pro konstrukce s omezeným prostorem a speciálními požadavky. Nabízí škálovatelný výkon a vylepšený výkon oproti předchozí generaci s až 8 jádry.
AV600-TH vyniká svou robustní konstrukcí a vysokou funkčností. Systém je vybaven konektory typu MIL-STD Amphenol a plnou ochranou IP66, díky čemuž odolá jakémukoli drsnému prostředí. AV600TH podporuje rozšířený teplotní rozsah od -40 °C do 55 °C a napájení MIL-STD-461 18 V~36 V DC, které chrání systém před poškozením způsobeným náhlým nárůstem napětí, čímž dále zvyšuje spolehlivost jeho kritických komponent a samotného systému.
- MIL-STD 810 Thermal, shock, vibration, Humidity / EMI / EMC conditions
- IP66 Chassis with D38999 connectors
- Intel® 11th Gen. Tiger Lake (H) Xeon® W-11865MLE processor
- Up to 96 GB DDR4 SO-DIMM, non-ECC and ECC
- NVIDIA RTX™ A1000, 2048 CUDA® cores, 4GB GDDR6 memory
- MIL-STD-461 18V~36V DC-Input (Options for MIL-704/1275)
- Extreme Temperature : -40°C to +60°C
- Optional with External GPU Turbo Kit
- Dimensions : 250(L) x 325 (W) x 100 (H) mm
Special Request :
- Optional IP66
- Frame Grabber : 4 x CH HD-SDI
- Discrete IO : 4 x DI 4 x DO
- 10GbE : Dual 10GbE (Intel X710) Ethernet Ports
- Dual Redundant MIL-STD-1553 connections
- Dual ARINC 429 input connections
Specifikace
| System | ||||
|---|---|---|---|---|
|
CPU |
Xeon W-11865MLE (8 Cores/16 Threads, 24M Cache, up to 4.50 GHz), 25W |
|||
|
Memory type |
4x 260 Pin DDR4 2400MHz SO-DIMM (up to 96GB, XEON®SKU support ECC) |
|||
|
CHIPSET |
CM246 |
|||
|
GPU |
NVIDIA RTX™ A1000 embedded graphics - Standard MXM 3.1 Type A (82 x 70 mm) - 2048 CUDA® cores, 16 RT Cores, and 64 Tensor Cores - 6.66TFLOPS peak FP32 performance - 4GB GDDR6 memory, 128-bit |
|||
| On board Storage | mSATA 512GB | |||
|
Expansion Slot |
1x M.2(M-key,Type: 2280 , SATA/PCIe 3.0 x 4 NVMe) 2x Mini PCIe Full size (USB / PCIe and 1x micro SIM Card) 1x PCIe/104, 1x FPE |
|||
| TPM | TPM 2.0 (SLB9665) | |||
|
VIDEO INPUT |
4 Channel capture module for 4 x SMA male connectors >(optional) | |||
| Storage | ||||
| SATA | 1x 2.5” SSD | |||
|
M.2 |
1x 2280 M key (SATA only) |
|||
| Ethernet | ||||
|
Ethernet (Internal) |
2x 10/100/1000 Ethernet Ports |
|||
| Front I/O | ||||
| DC-in | 1x DC-in , with D38999 connector | |||
| X1 | 1x DVI , with D38999 connector | |||
| X2 | 1x DVI , with D38999 connector | |||
| X3 | 2x GLAN + 3x USB 2.0, with D38999 connector | |||
| X4 | 4x RS232/422/485 + 4 BIT DIO, with D38999 connector | |||
| LED | 1x SSD/HDD LED indicator | |||
| switch | 1x IP65 power button , with LED indicator | |||
| Power | ||||
|
Power input |
MIL-STD -461 18V~36V DC-Input |
|||
| Application, Operating System | ||||
| Application | Military Platforms Requiring Compliance to MIL-STD-810 Where Harsh Temperature, Shock, Vibration, Altitude, Dust and MIL-461 EMI Conditions. | |||
| Operating System | Windows® 10 64-bit / Linux (support by request) | |||
| Physical | ||||
|
Dimension |
246(L) x 325 (W) x 100 (H)mm |
|||
|
Weight |
10.5 Kg |
|||
|
Chassis |
Aluminum Alloy |
|||
|
Heatsink |
Heatsink Aluminum Alloy, Corrosion Resistant |
|||
| Environmental | ||||
|
Green Product |
RoHS, WEEE compliance |
|||
|
Operating Temp. |
-40°C to +60°C |
|||
|
Storage Temp. |
-40°C to +85°C |
|||
|
Relative Humidity |
5% to 95%, non-condensing |
|||
| MIL-STC-810 | Method 507.5, Procedure II ( Temperature & Humidity ) Method 516.6 Shock-Procedure V Non-Operating ( Mechanical Shock ) Method 516.6 Shock-Procedure I Operating ( Mechanical Shock ) Method 514.6 Vibration Category 24/Non-Operating ( Category 20 & 24, Vibration ) Method 514.6 Vibration Category 20/Operating ( Category 20 & 24, Vibration ) Method 501.5, Procedure I ( Storage/High Temperature ) Method 501.5, Procedure II ( Operation/High Temperature ) Method 502.5, Procedure I ( Storage/Low Temperature ) Method 502.5, Procedure II ( Operation/Low Temperature ) Method 503.5, Procedure I ( Temperature shock ) |
|||
| Reliability | No Moving Parts; Passive Cooling. Designed & Manufactured using ISO 9001 / 2000 Certified Quality Program. |
|||
| MIL-STD-461 | CE102 basic curve, 10kHz - 30 MHz RE102-4, (1.5 MHz) -30 MHz - 5 GHz RS103, 1.5 MHz - 5 GHz, 50 V/m equal for all frequencies |
|||
| EMC | EN 61000-4-2: Air discharge: 8 kV, Contact discharge: 6kV EN 61000-4-3: 10V/m EN 61000-4-4: Signal and DC-Net: 1 kV EN 61000-4-5: Leads vs. ground potential 1kV, Signal und DC-Net: 0.5 kV CE and FCC |
|||
| Designed to Meet Items ( Options ) | ||||
| CS101, CS114, CS115, CS116 | ||||
| CE106, RE103, RS101 | ||||
| MIL-STD-1275 | Steady State | 20V-33V | ||
| Surge Low | 18V/500ms | |||
| Surge High | 100V/500ms | |||
Fotogalerie
Zobrazit všechny fotky
Ke stažení
NAVRHNEME VÁM ŘEŠENÍ NA KLÍČ
Hledáte technologického partnera? Neváhejte se na nás obrátit.
