7SL-R760

Intel 4/5TH XEON SP 2U, 2P Dell Military GPU Server

Petr Chalupa

Petr Chalupa

Odolné PC, Military, TEMPEST, Doprava +420 251 614 073

Popis

Díky integraci odolnosti proti vibracím a nárazům certifikované podle normy MIL-STD-810G posiluje společnost 7StarLake serverové platformy Dell, včetně modelů XR-5610, XR-7620 a R760, proti nejnáročnějším provozním výzvám. Kromě toho společnost 7StarLake využívá své rozsáhlé odborné znalosti v oblasti řízení teploty a optimalizuje tyto servery tak, aby bezproblémově fungovaly v teplotním rozmezí od -30 °C do +55 °C, což je činí ideálními pro použití v obraně, letectví a průmyslu.

  • Dual Intel® 4/5th XEON® SP , Dell Military GPU Server
  • Up to 8 PCIe slots : 

        ◎4x 16 Gen4/Gen5 Full-Height/Full Length
        ◎2 x8/x16 Gen4/Gen5 Full-Height/Full-Length
        ◎2x 16 LP Gen4 Low profile, Half Length

  • 1 x USB 2.0, 1 x iDRAC Direct (Micro-AB USB 2.0), 1 x iDRAC dedicated, 1x USB 3.0, 1 x Serial port(optional), 1x VGA
  • MIL-STD-810 Vibration Method 514.6 : ◎Acceleration : 5.0 Grms
  • MIL-STD-810 Vibration Method 514.6 : ◎ PSD : 0.01257 g2/Hz
  • MIL-STD-810 Shock Method 516.6 : ◎Wave Form : Half Shine Wave
  • MIL-STD-810 Shock Method 516.6 : ◎Acceleration : 20G
  • MIL-STD-810 Temperature Method 501.5 502.5 : ◎Operating Temp. High 55°C
  • MIL-STD-810 Temperature Method 501.5 502.5 : ◎Operating Temp. Low -30°C

Specifikace

Processor 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Socket E (LGA-4677)
CPU Core Count Up to 16 Cores/32 Cores
Memory Type DDR5-5600MT/s RDIMM ECC, up to 1TB in 8 DIMM slot
GPU Options Up to 5 x 75W (Single Width Full Height/Half Length, Low Profile) GPU or Up to 2 x 300W (Double Width Full Height/Full Length)
TPM Chipset: Infineon, Type: TPM 2.0
IPMI iDRAC RESTful API with Redfish
BIOS AMI UEFI BIOS
USB 1x USB3.0 +1x USB2.0 ports
Ethernet 2x 25G Ethernet SFP+ Ports & 2 x 10G Ethernet RJ45 Ports
Power Type 100V~240V AC IN Redundant
Storage 24x 2.5” Swappable SATA SAS, or NVMe (HDD/SSD/U.2)
Operating Temp. -10°C to +55°C
Dimension 482mm(W) x 572mm(D) x 86mm(H)
Front I/O 1x Power Button
1x SSD LED indicator
4x Swappable SSD Tray
1x iDRAC Direct (Micro-AB USB 2.0) port, 1 x USB 2.0
StorageRear I/O 1x iDRAC dedicated Direct port
1x USB3.0
1x (Micro-AB USB 2.0)
2x 25G LAN1
2x 10G LAN
1x Mini-DP or VGA
MIL-STD-810 Test Method 500.5, Procedures I and II (Altitude, Operation):
12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia)

Method 500.5, Procedures III and IV (Altitude, Non-Operation):
15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia)

Method 501.5, Procedure I (Storage/High Temperature)
Method 501.5, Procedure II (Operation/High Temperature)
Method 502.5, Procedure I (Storage/Low Temperature)
Method 502.5, Procedure II (Operation/Low Temperature)
Method 503.5, Procedure I (Temperature shock)
Method 507.5, Procedure II (Temperature & Humidity)
Method 509.7 Salt Spray (50±5)g/L(Optional for Conformal Coating)
Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration)
Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration)
Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock)
Method 516.6, Shock-Procedure I Operating (Mechanical Shock)
Operating Temp. -10°C to +55°C
Storage Temp. -20°C to +60°C
Relative Humidity 5% to 95%, non-condensing

Fotogalerie

Ke stažení

NAVRHNEME VÁM ŘEŠENÍ NA KLÍČ

Hledáte technologického partnera? Neváhejte se na nás obrátit.

šipka nahoru