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7SL-R760
Intel 4/5TH XEON SP 2U, 2P Dell Military GPU Server
Popis
Díky integraci odolnosti proti vibracím a nárazům certifikované podle normy MIL-STD-810G posiluje společnost 7StarLake serverové platformy Dell, včetně modelů XR-5610, XR-7620 a R760, proti nejnáročnějším provozním výzvám. Kromě toho společnost 7StarLake využívá své rozsáhlé odborné znalosti v oblasti řízení teploty a optimalizuje tyto servery tak, aby bezproblémově fungovaly v teplotním rozmezí od -30 °C do +55 °C, což je činí ideálními pro použití v obraně, letectví a průmyslu.
- Dual Intel® 4/5th XEON® SP , Dell Military GPU Server
- Up to 8 PCIe slots :
◎4x 16 Gen4/Gen5 Full-Height/Full Length
◎2 x8/x16 Gen4/Gen5 Full-Height/Full-Length
◎2x 16 LP Gen4 Low profile, Half Length
- 1 x USB 2.0, 1 x iDRAC Direct (Micro-AB USB 2.0), 1 x iDRAC dedicated, 1x USB 3.0, 1 x Serial port(optional), 1x VGA
- MIL-STD-810 Vibration Method 514.6 : ◎Acceleration : 5.0 Grms
- MIL-STD-810 Vibration Method 514.6 : ◎ PSD : 0.01257 g2/Hz
- MIL-STD-810 Shock Method 516.6 : ◎Wave Form : Half Shine Wave
- MIL-STD-810 Shock Method 516.6 : ◎Acceleration : 20G
- MIL-STD-810 Temperature Method 501.5 502.5 : ◎Operating Temp. High 55°C
- MIL-STD-810 Temperature Method 501.5 502.5 : ◎Operating Temp. Low -30°C
Specifikace
| Processor | 5th Gen Intel® Xeon® / 4th Gen Intel® Xeon® Scalable processors, Socket E (LGA-4677) |
| CPU Core Count | Up to 16 Cores/32 Cores |
| Memory Type | DDR5-5600MT/s RDIMM ECC, up to 1TB in 8 DIMM slot |
| GPU Options | Up to 5 x 75W (Single Width Full Height/Half Length, Low Profile) GPU or Up to 2 x 300W (Double Width Full Height/Full Length) |
| TPM | Chipset: Infineon, Type: TPM 2.0 |
| IPMI | iDRAC RESTful API with Redfish |
| BIOS | AMI UEFI BIOS |
| USB | 1x USB3.0 +1x USB2.0 ports |
| Ethernet | 2x 25G Ethernet SFP+ Ports & 2 x 10G Ethernet RJ45 Ports |
| Power Type | 100V~240V AC IN Redundant |
| Storage | 24x 2.5” Swappable SATA SAS, or NVMe (HDD/SSD/U.2) |
| Operating Temp. | -10°C to +55°C |
| Dimension | 482mm(W) x 572mm(D) x 86mm(H) |
| Front I/O | 1x Power Button 1x SSD LED indicator 4x Swappable SSD Tray 1x iDRAC Direct (Micro-AB USB 2.0) port, 1 x USB 2.0 |
| StorageRear I/O | 1x iDRAC dedicated Direct port 1x USB3.0 1x (Micro-AB USB 2.0) 2x 25G LAN1 2x 10G LAN 1x Mini-DP or VGA |
| MIL-STD-810 Test | Method 500.5, Procedures I and II (Altitude, Operation): 12,192M, (40,000 ft) for the initial cabin altitude (18.8Kpa or 2.73 Psia) Method 500.5, Procedures III and IV (Altitude, Non-Operation): 15,240, (50,000 ft) for the initial cabin altitude (14.9Kpa or 2.16 Psia) Method 501.5, Procedure I (Storage/High Temperature) Method 501.5, Procedure II (Operation/High Temperature) Method 502.5, Procedure I (Storage/Low Temperature) Method 502.5, Procedure II (Operation/Low Temperature) Method 503.5, Procedure I (Temperature shock) Method 507.5, Procedure II (Temperature & Humidity) Method 509.7 Salt Spray (50±5)g/L(Optional for Conformal Coating) Method 514.6, Vibration Category 24/Non-Operating (Category 20 & 24,Vibration) Method 514.6, Vibration Category 20/Operating (Category 20 & 24,Vibration) Method 516.6, Shock-Procedure V Non-Operating (Mechanical Shock) Method 516.6, Shock-Procedure I Operating (Mechanical Shock) |
| Operating Temp. | -10°C to +55°C |
| Storage Temp. | -20°C to +60°C |
| Relative Humidity | 5% to 95%, non-condensing |
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